GeForce RTX 2070 WINDFORCE 8G
GIGABYTE GeForce RTX 2070 8GB GDDR6
The NVIDIA GeForce RTX 2070 GPU is based on the ground-breaking Turning architecture that was built using 12nm FinFET—a new generation of graphics chip engineered for a new level of realism. This graphics card series incorporates brand-new, Industry-changing, real-time ray tracing. AI and shading technology to transform gaming visuals with lifelike reflections, refractions and shadows. Meanwhile.Deep Learning Super Sampling enables much smoother frame rates and less burden on the GPU than previous-generation.nti-aliasing technology. The GeForce RTX 2070 card packs 2,304 CUDA Cores, and 8GB of GDDR6/256-bit memory running at 14Gbps (reference card frequency), offers WINDFORCE 3X Cooling System to keep heat in check. And provides RGB lighting
The GIGABYTE patent “Alternate Spinning” is the only solution that can solve the turbulent airflow of three fans. The biggest problem with the three fans is turbulence. Since the fans rotate in the same direction, the airflow direction is opposite between the fans, which will cause turbulent airflow and reduce heat-dissipation efficiency. GIGABYTE turns the middle fan in the opposite direction, so that the airflow direction between the two fans is the same.Reducing the turbulence and enhancing airflow pressure.
UNIQUE BLADE FAN
Airflow is spilt by the triangular fan edge and guided smoothly through the 3D stripe curve on the fan surface. For overall effective enhancement.
3D ACTIVE FAN
The 3D Active Fan provides semi-passive cooling, And the fans will remain off when.The GPU is in a low load or low power game. It allows gamers to enjoy gameplay in complete silence when the system is running light or idle.
HEAT-PIPES DIRECT TOUCH
The shape of the pure copper heat pipe maximizes the direct contact area with the GPU, enhancing heat transfer. The heat pipe also covers the VRAM through a large metal plate contact to ensure proper cooling.
COMPOSITE HEAT PIPES
The composite heat pipes combines thermal conductivity,And phase transition to efficiently manage the heat transfer between two solid interfaces which increases cooling capacity.
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