ASUS GeForce GTX 1070 8GB GDDR5 PCI
ASUS GeForce GTX 1070 8GB GDDR5 PCI
| Brand | ASUS |
|---|---|
| Model | STRIX-GTX1070-8G-GAMING |
| InterfaceĀ | PCI Express 3.0 |
|---|
| Chipset Manufacturer | NVIDIA |
|---|---|
| GPU Series | NVIDIA GeForce GTX 10 Series |
| GPUĀ | GeForce GTX 1070 |
| Core ClockĀ | 1531 MHz in OC mode 1506 MHz in Gaming mode |
| Boost ClockĀ | 1721 MHz in OC mode 1683 MHz in Gaming mode |
| CUDA CoresĀ | 1920 |
| Effective Memory ClockĀ | 8000 MHz |
|---|---|
| Memory Size | 8GB |
| Memory InterfaceĀ | 256-Bit |
| Memory Type | GDDR5 |
| OpenGLĀ | OpenGL 4.5 |
|---|
| HDMIĀ | 2 x HDMI 2.0 |
|---|---|
| DisplayPortĀ | 2 x DisplayPort 1.4 |
| DVIĀ | 1 x Dual-link DVI-D |
| Max Resolution | 7680 x 4320 |
|---|---|
| Virtual Reality Ready | Yes |
| Cooler | Triple Fans |
| Thermal Design PowerĀ | 150W |
| Dual-Link DVI Supported | Yes |
| HDCP ReadyĀ | Yes |
| Features | 1721 MHz Boost Clock with Super Alloy Power II Delivery
Aura RGB Lighting on both shroud and backplate New ASUS FanConnect provides dual 4-pin GPU-controlled PWM fan headers DirectCU III with 0dB fan technology and patented wing-blade fans VR Ready with dual HDMI 2.0 ports to simultaneously connect headset & monitor |
|---|
| Max GPU Length | 298 mm |
|---|---|
| Card Dimensions (L x H) | 11.73ā³ x 5.28ā³ |
| Slot Width | Dual Slot |
| Date First Available | July 07, 2021 |
|---|
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NEW DIRECTIONS
To bolster the specialized roles ofĀ the center and auxiliary fans, the rotational direction of the center fan is reversed. This reduces air turbulence inside the cooling array for another boost to overall thermal performance. The fans also shut off completely when card powerĀ consumption is lowĀ and the GPU temperature falls beneath 48 Celsius, keeping noise levels down when the system is idling or under a light load.
HEATSINK
MAXCONTACT
To get heat up off the die and into the heatsink array to benefit from the new fan design requires special attention. We use a manufacturing process that polishes the surface of the heat spreader to improve smoothness at the microscopic level. The extra flatness allows for better contact with the die for improved thermal transfer.
2.9-SLOT DESIGN
The heat spreader draws heat up into heatpipes that carry it through a fin stack that fills a large 2.9-slot footprint. Increasing the heatsink size compared to the lastĀ generation providesĀ more thermal headroom to account for
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